The 47th International Technical Exhibition on Image Technology and Equipment (ITE 2025) will take place from December 3–5 at PACIFICO Yokohama Hall D in Japan, bringing together global leaders in machine vision and industrial imaging. SinceVision has confirmed its participation, presenting a broad range of industrial sensors, 3D measurement systems, and high-speed imaging solutions for the Japan and Asia-Pacific markets.

ITE Japan remains the country’s largest platform for industrial image technology, supported by the Imaging Association Japan (IAJ) and the Japan Industrial Imaging Association (JIIA). The event continues to serve key sectors such as automotive, semiconductor, aerospace, and precision manufacturing—areas where imaging performance directly impacts production quality.

SinceVision will exhibit its full portfolio of industrial sensors and high-speed cameras booth 78. The company will run five live demonstrations showing how imaging and 3D measurement address practical challenges in electronics production, automotive component quality, semiconductor alignment, and battery manufacturing.

Live Demonstrations at ITE 2025

The applications demo will include:

1. PCB solder joint inspection – Using the SR7060D 3D laser profiler to capture solder height and surface data in real time.
2. Automotive gear measurement – The SR90603D profiler will scan gear surfaces and edges for dimensional accuracy.
3. Wafer alignment and thickness inspection – Through-beam and confocal sensors will show how wafer edges and thickness variations are detected in semiconductor production.
4. BGA solder ball height measurement – The SR8010 system will assess solder ball uniformity for high-density packaging.
5. Weld and step-gap inspection – The SRI8062 profiler will identify weld deviations, dents, and gap inconsistencies with micron-level detection.

These demonstrations highlight common inspection requirements in automotive, semiconductor, lithium battery, and electronics manufacturing—sectors where Japan maintains global leadership.

Displacement Sensors on Display

SinceVision will also introduce six displacement sensor series: SCI04025, SGI080, SG5080, SD33, SD22, and SD-C030. These sensors support high-speed distance measurement and repeatability requirements across automotive assembly, wafer production, and precision machining.

Manufacturers in Japan and the wider Asia-Pacific region are increasing their investments in high-speed inspection and automated quality control. ITE 2025 gives industry engineers, integrators, and R&D teams a direct look at SinceVision’s capabilities in 3D metrology, inline inspection, and scientific imaging.

Visitors can meet SinceVision’s engineering team at Booth 78 to discuss project requirements, evaluation samples, and integration support.

Meeting requests and product inquiries:
[email protected]

Website: www.sincevision.com